In the ever-evolving electronics landscape, innovation is key to meeting the demands of miniaturization, automation, and hyperconnectivity. It is in this context that the thermoplastic compound V0HF1X emerges, a revolutionary solution for maximum flame retardancy at low thicknesses.
Tomorrow’s electronics: miniaturization, automation, smart technologies, hyperconnectivity.
New trends in electronics highlight the increase in complex and integrated applications, housed in increasingly smaller and more compact enclosures. The progressive reduction in plastic wall thicknesses, often just a few tenths of a millimeter, requires advanced materials capable of ensuring high mechanical, electrical, and thermal performance, as well as solid resistance to fire, glow wire, and tracking currents.
The LATI Product Portfolio
LATI’s portfolio for environmentally friendly flame-resistant compounds is known by the code V0HF1 and is available in PA6, PA66, PBT, and PPA: these grades have UL94-V0 certification down to 0.75mm, GWIT 775°C at 1 and 2 mm, as well as tracking resistance (CTI) of 600V.
The Future of Flame-Retardant Materials
For demanding sectors, such as next-generation connector systems or integrated electronics with challenging overmolding, LATI has developed V0HF1X, a new family of glass fiber reinforced PA66-based compounds, which ensure maximum flame retardancy down to thicknesses of 0.4 mm without compromising other properties. The first product in this line,
To learn more, visit the page dedicated to flame-retardant materials or contact us
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